<![CDATA[ Search for 'su:"Integrated Circuit Technology"']]>

<![CDATA[ Search for 'su:"Integrated Circuit Technology"']]> http://opac.daiict.ac.in/cgi-bin/koha/opac-search.pl?q=ccl=su%3A%22Integrated%20Circuit%20Technology%22&format=rss2 8 0 50 IC interconnect analysis ISBN 1402070756 http://opac.daiict.ac.in/cgi-bin/koha/opac-detail.pl?biblionumber=4752 By Celik, Mustafa. Boston: Springer, 2002 . vii, 310 p.; 24 cm.. 1402070756

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]]> http://opac.daiict.ac.in/cgi-bin/koha/opac-detail.pl?biblionumber=4752 Interconnect technology and design for gigascale integration ISBN 1402076061 http://opac.daiict.ac.in/cgi-bin/koha/opac-detail.pl?biblionumber=4796 By Meindle, James D.. Boston: Kluwer Academic, 2003 . xiii, 411 p.; 24 cm.. 1402076061

Place Hold on Interconnect technology and design for gigascale integration

]]> http://opac.daiict.ac.in/cgi-bin/koha/opac-detail.pl?biblionumber=4796 Interconnect-centric design for advanced SOC and NOC ISBN 1402078358 http://opac.daiict.ac.in/cgi-bin/koha/opac-detail.pl?biblionumber=4807 By Nurmi, Jari. Boston: Kluwer Academic Publishers, 2004 . vi, 453 p.; 25 cm.. 1402078358

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]]> http://opac.daiict.ac.in/cgi-bin/koha/opac-detail.pl?biblionumber=4807 On-chip communication architectures : system on chip interconnect ISBN 9780123738929 http://opac.daiict.ac.in/cgi-bin/koha/opac-detail.pl?biblionumber=11584 By Pasricha, Sudeep. Burlington: Morgan Kaufmann, 2008 . xvii, 522 p.; 25 cm.. 9780123738929

Place Hold on On-chip communication architectures : system on chip interconnect

]]> http://opac.daiict.ac.in/cgi-bin/koha/opac-detail.pl?biblionumber=11584 Future Trends in Microelectronics ISBN 9780471321835 http://opac.daiict.ac.in/cgi-bin/koha/opac-detail.pl?biblionumber=16029 By Luryi, Serge. New York: John Wiley & Sons, 1999 . 485 p.; 24 cm.. 9780471321835

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]]> http://opac.daiict.ac.in/cgi-bin/koha/opac-detail.pl?biblionumber=16029 Circuit and interconnect design for RF and high bit-rate applications ISBN 9781402068829 http://opac.daiict.ac.in/cgi-bin/koha/opac-detail.pl?biblionumber=20080 By Veenstra, Hugo. New York: Springer, 2008 . xii, 246 p.; 25 cm.. 9781402068829

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]]> http://opac.daiict.ac.in/cgi-bin/koha/opac-detail.pl?biblionumber=20080 Integrated interconnect technologies for 3D nanoelectronic systems ISBN 9781596932463 http://opac.daiict.ac.in/cgi-bin/koha/opac-detail.pl?biblionumber=21263 By Bakir, Muhannad S.. Boston: Artech House, 2008 . xx, 528 p.; 26 cm.. 9781596932463

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]]> http://opac.daiict.ac.in/cgi-bin/koha/opac-detail.pl?biblionumber=21263 How transistor area shrank by 1 million fold ISBN 9783030400200 http://opac.daiict.ac.in/cgi-bin/koha/opac-detail.pl?biblionumber=32445 By Tigelaar, Howard. Cham : Springer, 2020 . xxiv, 319 p. ; 25 cm. 9783030400200

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]]> http://opac.daiict.ac.in/cgi-bin/koha/opac-detail.pl?biblionumber=32445