Brown, William D.
Advanced Electronic Packaging with Emphasis on Multichip Modules
- New York: IEEE Press, 1999
- 791 p.; Illus. Index.: 25 cm.
9780780347007 (hbk)
Electrical Design
Electronic Packaging
Microelectronic Packaging
Modeling and Simulation
Multichip Modules
621.381046 / BRO