Brown, William D.

Advanced Electronic Packaging with Emphasis on Multichip Modules - New York: IEEE Press, 1999 - 791 p.; Illus. Index.: 25 cm.

9780780347007 (hbk)


Electrical Design
Electronic Packaging
Microelectronic Packaging
Modeling and Simulation
Multichip Modules

621.381046 / BRO

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