Item type | Current location | Call number | Status | Date due | Barcode |
---|---|---|---|---|---|
Books | 621.38152 LAU (Browse shelf) | Available | 034899 |
621.38152 KIT Principles of solar cells, LEDs and diodes : the role of the PN junction | 621.38152 KOR Semiconductors for micro- and nanotechnology : an introduction for engineers | 621.38152 LAC Micromachined thin-film sensors for SOI-CMOS co-integration | 621.38152 LAU Semiconductor advanced packaging | 621.38152 LEA Microelectronic devices | 621.38152 LEE CMOS biotechnology | 621.38152 LEV Breakdown phenomena in semiconductors and semiconductor devices |
Includes bibliographical references and index.
The book focuses on the design, materials, process, fabrication, and reliability of advanced semiconductor packaging components and systems. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as system-in-package, fan-in wafer/panel-level chip-scale packages, fan-out wafer/panel-level packaging, 2D, 2.1D, 2.3D, 2.5D, and 3D IC integration, chiplets packaging, chip-to-wafer bonding, wafer-to-wafer bonding, hybrid bonding, and dielectric materials for high speed and frequency. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.
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