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1.
Interconnect analysis and synthesis

by Cheng, Chung-Kuan.

Material type: book Book; Format: print ; Literary form: Not fiction Publisher: New York: John Wiley & Sons, 2000Availability: Items available for loan: [Call number: 621.3815 CHE] (1).
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2.
Engineering circuit analysis

by Hayt, William H | Durbin, Steven M | Kemmerly, Jack E.

Edition: 6th ed.Material type: book Book; Format: print ; Literary form: Not fiction Publisher: New Delhi: Tata McGraw-Hill, 2006Availability: Items available for loan: [Call number: 621.3192 HAY] (18).
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3.
Engineering circuit analysis

by Hayt, William H | Durbin, Steven M | Kemmerly, Jack E.

Edition: 7th ed.Material type: book Book; Format: print ; Literary form: Not fiction Publisher: New York: McGraw-Hill, 2007Availability: Items available for loan: [Call number: 621.3192 HAY] (1).
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4.
Engineering circuit analysis

by Hayt, William H | Durbin, Steven, M | Kemmerly, Jack E.

Edition: 7th ed.Material type: book Book; Format: print ; Literary form: Not fiction Publisher: Boston: McGraw-Hill, 2006Availability: Items available for loan: [Call number: 621.3192 HAY] (4).
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5.
Engineering circuit analysis

by Hayt, William H | Durbin, Steven M | Kemmerly, Jack E.

Edition: 6th ed.Material type: book Book; Format: print ; Literary form: Not fiction Publisher: New Delhi: Tata McGraw-Hill, 2002Availability: Items available for loan: [Call number: 621.3192 HAY] (2).
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6.
RF and microwave coupled-line circuits

by Mongia, R. K.

Edition: 2nd ed.Material type: book Book; Format: print ; Literary form: Not fiction Publisher: Boston: Artech House, 2007Availability: Items available for loan: [Call number: 621.38132 MON] (1).
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