1. IC interconnect analysis

by Celik, Mustafa | Odabasioglu, Altan | Pileggi, Lawrence.

Material type: book Book; Format: print ; Literary form: Not fiction Publisher: Boston: Springer, 2002Availability: Items available for loan: [Call number: 621.395 CEL] (1).
2. Interconnect technology and design for gigascale integration

by Meindle, James D.

Material type: book Book; Format: print ; Literary form: Not fiction Publisher: Boston: Kluwer Academic, 2003Availability: Items available for loan: [Call number: 621.38152 DAV] (1).
3. Interconnect-centric design for advanced SOC and NOC

by Nurmi, Jari | Isoaho, Jouni | Jantsch, Axel | Tenhunen, Hannu.

Material type: book Book; Format: print ; Literary form: Not fiction Publisher: Boston: Kluwer Academic Publishers, 2004Availability: Items available for loan: [Call number: 621.3815 NUR] (1).
4. On-chip communication architectures : system on chip interconnect

by Pasricha, Sudeep | Dutt, Nikil.

Material type: book Book; Format: print ; Literary form: Not fiction Publisher: Burlington: Morgan Kaufmann, 2008Availability: Items available for loan: [Call number: 621.3815 PAS] (1).
5. Future Trends in Microelectronics

by Luryi, Serge | Xu, Jimmy | Zaslavsky, Alex.

Material type: book Book; Format: print ; Literary form: Not fiction Publisher: New York: John Wiley & Sons, 1999Availability: Items available for loan: [Call number: 621.381 LUR] (1).
6. Circuit and interconnect design for RF and high bit-rate applications

by Veenstra, Hugo | Long, John R.

Material type: book Book; Format: print ; Literary form: Not fiction Publisher: New York: Springer, 2008Availability: Items available for loan: [Call number: 621.3815 VEE] (1).
7. Integrated interconnect technologies for 3D nanoelectronic systems

by Bakir, Muhannad S | Meindl, James D.

Material type: book Book; Format: print ; Literary form: Not fiction Publisher: Boston: Artech House, 2008Availability: No items available Checked out (1).
8. How transistor area shrank by 1 million fold

by Tigelaar, Howard.

Publisher: Cham : Springer, 2020Availability: Items available for loan: [Call number: 621.3815 TIG] (1).

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