1. Routing in the third dimension : from VLSI chips to MCMs

by Sherwani, Naveed A | Bhingarde, Siddharth | Panyam, Anand.

Material type: book Book; Format: print ; Literary form: Not fiction Publisher: New York: IEEE Press, 1995Availability: Items available for loan: [Call number: 621.395 SHE] (1).
2. Advanced Electronic Packaging with Emphasis on Multichip Modules

by Brown, William D.

Material type: book Book; Format: print ; Literary form: Not fiction Publisher: New York: IEEE Press, 1999Availability: Items available for loan: [Call number: 621.381046 BRO] (1).

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