000 | a | ||
---|---|---|---|
999 |
_c30839 _d30839 |
||
008 | 220601b xxu||||| |||| 00| 0 eng d | ||
020 | _a9781316649794 | ||
082 |
_a621.395 _bTAU |
||
100 | _aTaur, Yuan | ||
245 | _aFundamentals of modern VLSI devices | ||
250 | _a2nd ed. | ||
260 |
_bCambridge University Press, _c2022 _aCambridge : |
||
300 |
_axxiii, 656 p. ; _bill., _c25 cm |
||
365 |
_b1195.00 _cINR _d01 |
||
504 | _aIncludes bibliographical references and index. | ||
520 | _aThe great advances made in VLSI technology in recent years have been underpinned by rapid developments in the design and fabrication of CMOS and bipolar devices, particularly at the deep submicron level. This book examines in detail the basic properties and design of these devices, including chip integration, and discusses the various factors that affect their performance. The book contains many exercises, and can be used as a textbook for senior undergraduate or first-year graduate courses on microelectronics or VLSI devices. It will also be a valuable reference volume for practicing engineers involved in research and development in the electronics industry. | ||
650 | _aMetal oxide semiconductors Complementary | ||
650 | _aBipolar transistors | ||
650 | _aIntegrated circuits | ||
650 | _aComplementary | ||
650 | _aBallistic transport | ||
650 | _aCoulomb scattering | ||
650 | _a Drain-current model | ||
650 | _a Drift-diffusion model | ||
650 | _aEbers-Moll model | ||
650 | _aFermi level | ||
650 | _aGummel plot | ||
650 | _aHigh-level injection | ||
650 | _aJunction capacitance | ||
650 | _aKrik effect | ||
650 | _a Multiple- gate (MG)MOSFET | ||
650 | _a Nonvolatile memory | ||
650 | _a Parastic resistance | ||
650 | _a Quasi-Fermi level | ||
650 | _aSaturation point | ||
650 | _aTwo-way NAND | ||
650 | _a Velocity-field relationship | ||
650 | _aWeb-ster effect | ||
650 | _a SRAM | ||
700 | _aNing, Tak H. | ||
942 |
_2ddc _cBK |