000			nam a22 4500
999			_c33107 _d33107
008			240319b xxu||||| |||| 00| 0 eng d
020			_a9789811613784
082			_a621.38152 _bLAU
100			_aLau, John H.
245			_aSemiconductor advanced packaging
260			_bSpringer, _c2021 _aCham :
300			_axxii, 498 p. ; _bill. (chiefly col.), _c23 cm.
365			_b109.99 _c€ _d93.50
504			_aIncludes bibliographical references and index.
520			_aThe book focuses on the design, materials, process, fabrication, and reliability of advanced semiconductor packaging components and systems. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as system-in-package, fan-in wafer/panel-level chip-scale packages, fan-out wafer/panel-level packaging, 2D, 2.1D, 2.3D, 2.5D, and 3D IC integration, chiplets packaging, chip-to-wafer bonding, wafer-to-wafer bonding, hybrid bonding, and dielectric materials for high speed and frequency. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.
650			_aMicroelectronic packaging
650			_aIntegration
650			_aHybrid bonding
942			_2ddc _cBK