Chip Scale Package ( CSP ) (Record no. 10385)

000 -LEADER
fixed length control field 00618nam a2200193Ia 4500
008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION
fixed length control field 161214s9999 xx 000 0 und d
020 ## - INTERNATIONAL STANDARD BOOK NUMBER
International Standard Book Number 9780070383043
Terms of availability (hbk)
082 ## - DEWEY DECIMAL CLASSIFICATION NUMBER
Classification number 621.381
Item number LAU
100 ## - MAIN ENTRY--PERSONAL NAME
Personal name Lau, Jihn H.
245 #0 - TITLE STATEMENT
Title Chip Scale Package ( CSP )
260 ## - PUBLICATION, DISTRIBUTION, ETC. (IMPRINT)
Place of publication, distribution, etc New York:
Name of publisher, distributor, etc McGraw-Hill,
Date of publication, distribution, etc 1999
300 ## - PHYSICAL DESCRIPTION
Extent 564 p.;
Other physical details Illus. Index.:
Dimensions 24 cm.
650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name as entry element Design, Materials, Processes Reliability and Applications
Topical term or geographic name as entry element CSPs With Flexible Substrate
Topical term or geographic name as entry element Customized Lead Frame Based CSPs
Topical term or geographic name as entry element Electronic Packages
Topical term or geographic name as entry element Flip Chip and Wire Band for CSP
942 ## - ADDED ENTRY ELEMENTS (KOHA)
Source of classification or shelving scheme
Item type Books
952 ## - LOCATION AND ITEM INFORMATION (KOHA)
-- McGraw-Hill
Holdings
Withdrawn status Lost status Source of classification or shelving scheme Damaged status Not for loan Permanent location Current location Date acquired Source of acquisition Cost, normal purchase price Full call number Barcode Date last seen Date last borrowed Koha item type
          DAIICT DAIICT 2002-05-12 Gratis 0.00 621.381 LAU 004292 0000-00-00 0000-00-00 Books

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