Chip Scale Package ( CSP )
By: Lau, Jihn H.
Material type:
BookPublisher: New York: McGraw-Hill, 1999Description: 564 p.; Illus. Index.: 24 cm.ISBN: 9780070383043 .Subject(s): Design, Materials, Processes Reliability and Applications | CSPs With Flexible Substrate | Customized Lead Frame Based CSPs | Electronic Packages | Flip Chip and Wire Band for CSPDDC classification: 621.381
| Item type | Current location | Call number | Status | Date due | Barcode |
|---|---|---|---|---|---|
| Books | 621.381 LAU (Browse shelf) | Available | 004292 |
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