Advanced Electronic Packaging with Emphasis on Multichip Modules

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TextPublication details: New York: IEEE Press, 1999Description: 791 p.; Illus. Index.: 25 cmISBN:

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Cover image	Item type	Current library	Home library	Collection	Shelving location	Call number	Materials specified	Vol info	URL	Copy number	Status	Notes	Date due	Barcode	Item holds	Item hold queue priority	Course reserves
	Books	DAU				621.381046 BRO					Available			001513

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